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In terms of the particular transfer functions shown in Fig. 14.1, C/R becomes, after some rearrangement,

30,31

(34.13)

c -=

Recent work shows that process improvements are possible. Controlled etching has been attained in solutions containing 30 percent copper nitrate, water-soluble polymers, and surfactants. Dry-film resists work well in this etchant. An important finding was that straight wall trace edges were achieved using nitric acid. This could result in higher yields and density of fine-line boards. The major difficulty in obtaining the sidewall results is the requirement for specific crystollagraphic grain structure to the copper foil that has been difficult to reproduce in production quantities.

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Measurement of liquid level is usually noisy, because of splashing and turbulence of fluids entering the vessel. As we have seen, loops that resonate respond to random disturbances by oscillat ing at their natural period. As a result, level measurements are rarely quiet, often fluctuating 20 or 30 percent of scale. This is particularly true in vessels containing boiling liquids, where turbulence is high. Although a narrow proportional band, like the one determined in the example, may be sufficient, for control-loop stability, random fluctuations of only a few percent will drive the control valve to its limits. This may be unobjectionable in some cases, but too severe in others. Often the liquid level in a tank is used to control flow into another part of the process. It is certain that wide fluctuations in feed rate are not tolerated in most operations. To provide steady flow in these instances, the proportional band is widened and reset is relied upon t o maintain control. In many applications, exact regulation of liquid level is not important. In fact, a surge tank does not fulfill its purpose if t ight control is imposed on it. As a result, cont rol adjustments are often relaxed, and the process is sometimes left to be operated manually, if its time constant is long enough. In some applications, a special controller whose proportional band changes with deviation is warranted. This type of csontroller is devised to deliver smooth flow while level is normal, but to change flow radically in the event that high or low limits are approached. 5 discusses more details of this function.

Printed board laminates are usually composed of copper foils bonded to organic dielectric materials, ceramics, or other metals. 1. Organic dielectrics. These are thermosetting or thermoplastic resins usually combined with a selected reinforcing filler. Thermoset-reinforced materials used for rigid and flexible boards provide overall stability, chemical resistance, and good dielectric properties. Thermoplastic materials are also used for flexible circuit applications. A factor in material selection is the effect of process solutions, etchants, and solvents on the material. In addition, the adhesives used in laminating metal to substrate can be softened, loosened, and attacked by some solutions. Flat-surface planarity is an aid to precision etching. This can be improved by selection of laminate with fine glass woven structures that do not express a waviness to the free copper foil surface. 2. Thin-clad copper. Etched printed boards with epoxy laminate of 1 4 oz (9 mm) copper or less show minimal lateral etching, thus enabling higher fidelity to pattern-plated traces. The problem with very thin copper foils is pinhole density and fragility in the laminate

(7,s + l)(~~s + l)(~~s + 1) + K,

manufacturing process. One method of avoiding these problems is to start with a more conventional 1 2-oz (18-mm) foil and reduce its thickness by etching to a thinner state (3 to 9 mm).32 This technique depends on a uniform starting foil and a very well-controlled etching process. Although the particulars of the published process were not disclosed, cupric chloride and sodium persulfate formulations have been used for this process. 3. Reverse foil laminate. This construction is receiving attention for improving precision and control of etched lines. In order to achieve this foil structure, the tooth or crystalline roughness must also be controlled in the foil. The tooth side is usually placed on the dielectric interface of the laminate to increase peel strength and present a flat surface for processing. However, one variation is to place the drum or flat side of the laminate toward the dielectric and leave the tooth side upward.This forms a flat interface so that the etching stops at this surface, instead of the conventional extra etching to remove the teeth that are buried in dielectric. 4. Semiadditive copper. A copper thickness of 0.000050 to 0.000200 in with subsequent copper and resist metal plating shows no overhang or sliver formation. These layers must be of sufficient thickness and uniformity to withstand the cleaning and preparation steps for plating the required conductors.

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