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Proper instrumentation and training for this eventuality must be implemented 2 Solution control If there is insufficient free acid content in the etch sump to react with the oxidizer and copper (Eq 348), a dangerous imbalance can occur First, the instruments and controls may not respond properly, and the etch reaction may slow down Second, any subsequent addition of acid or mixing with acid-containing wastes can liberate chlorine gas in an uncontrolled and dangerous manner Proper chemical balance is another issue Water is added in all of the chemical streams and is produced in the chemical reaction Therefore, any excess chemical addition can dilute the chemistry and change the copper-holding ability of the etchant Hydrogen Peroxide Regeneration Hydrogen peroxide uses a two-part chemistry much like sodium chlorate ORP instrumentation is identical in the control of adding proportional amounts of oxidizer and hydrochloric acid.

Peroxide tends to decompose on sitting so that the spills are not as dangerous Older application of colorimetric cells for the control of dosing has largely been eliminated 1 Safety Hydrogen peroxide solutions can become unstable and disassociate into oxygen and water with the liberation of heatThis can occur with explosive force in a confined vessel such as a drum stored in sunlight or heat It can also occur in plumbing with closed valving..

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FIGURE P13-4 (a) Draw a block diagram of this control system, and in each block give the transfer function, with numerical values of the parameters. (b) Determine the controller gain K, for a critically damped response. (c) If the tanks were connected so that they were interacting, what is the value of K, needed for critical damping (6) Using 1.5 times the value of Kc determined in part (c), determine the response of the level in tank 2 to a step change in set point of 1 in. of level. 13.5. A PD controller is used in a control system having a first-order process and a measurement lag as shown in Fig. P13.5. (4 Find expmzons for 6 and T for the closed-loop response. (b) If 71 = 1 min, TV = 10 set, find K, so that l = 0.7 for the two cases: (1) 7-0 = 0, (2) 70 = 3 sec. (4 Compare the offset and period realized for both cases, and comment on the advantage of adding the derivative mode.

The decomposition is catalyzed by many metals, including Cu, Ni, and Fe. If traces of metal or metal salts are allowed to contaminate piping runs, the piping may also rupture explosively. Facilities should be constructed with pressure relief capabilities. Electrolytic Regeneration. The electrochemical reversal of the etching of copper shown in Eq. 34.9 and 34.10 is claimed to be effective and economical. Descriptions of this system are given in the literature.15 On a large scale, electrolytic regeneration requires a high investment in equipment and materials, as well as high power consumption. The chemical formulation is relatively high in acid content and low in copper, a condition not optimized for etching effectiveness or plating efficiency. The etchant is a solution of cupric chloride and hydrochloric acid (Table 34.1, no. 1). Etchant flows continuously between spray-etching machines and a plating tank. In the plating machine, two processes take place simultaneously: copper is plated at the cathode, and regeneration of the spent etchant occurs at the anodes. Copper recovery may not return copper value and may be expensive, inconvenient, and cause difficulty with recycling. 34.4.2.4 Problems with Cupric Chloride Systems

1 Slow etch rate Depending on chemical formulation, cupric chloride is inherently slower than ammonia and must be properly evaluated before production expectations are established Check to ensure no resist residues or chromate coatings remain on the panel surface before etching A slower than usual rate is frequently due to low temperatures, insufficient sump mixing, or poor solution chemical control If temperature and agitation are under control, slow etching with a dark green solution may result from a low cupric ion content, indicating insufficient oxidizer Acid must also be added to clarify cloudy solutions (Before acid addition, make sure excess oxidizer is not present) In regenerative systems, the source of oxidation may be depleted It is advisable to analyze specific gravity, free acid, and total chloride on a regular schedule and maintain control charts to ensure that bath controllers are consistent and operating properly 2 Sludging.

FIGURE P13-5 13.6. The thermal system shown in Fig. P13.6 is controlled by a PD controller. Data: w = 250 lb/min p = 62.5 lb/ft3

This occurs if acid is low or if water dilution occurs 3 Etcher goop This is a common floating accumulation of photoresist compounds leached into and precipitated from etch baths Accumulations appear to increase with higher acid formulations Formation can be limited by proper exposure of photoresists and continuous recirculation of the etch bath through carbon filtration Periodic, complete drain-down of the etching machinery and thorough mechanical and chemical equipment cleaning with a sulfamic acid type commercial cleaner can minimize problems 4 Yellow or white residues on copper surface Yellow residue is usually cuprous hydroxide It is water insoluble and is left when boards are etched and alkali-cleaned A white precipitate will probably be cuprous chloride, which can remain after etching in solutions that are low in chloride ion and acid.

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